2688A UCT 25.5MMx300M 2D Pack

Product Description

2688A UCT 25.5MMx300M 2D Pack

• 300 m rolls are available in standard widths of 5.4 mm, 9.3 mm, 13.3 mm and 21.3 mm
• Designed to offer smooth peeling performance with a tight range, helping reduce vibration and component movement, while increasing overall pick-and-place productivity
• Features an innovative peeling design with repeatable tracks and score lines to remove only the center part of the cover tape
• Highly recommended for WLCSP, bare dies and ultra-thin packages that require a high performing cover tape
• Transparent polypropylene film tape with layer of static dissipative coating on the component side and a synthetic, room temperature pressure sensitive adhesive strip along each edge
• Works well on 3M Polycarbonate Carrier Tapes

3M cover tape 2688A provides a very smooth peeling process and is appropriate for wafer level chip scale packages (WLCSP), bare dies and ultra thin packages.

For more information about 2688A UCT 25.5MMx300M 2D Pack, visit the official 3M website.

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