Product Description
Wafer De-Taping Tape 3305
- Enables simple, low-stress, room temperature peeling of 3M Adhesives from thinned silicon wafers after glass carrier debonding
- Good holding power
- High instant adhesion to substrate
- Transparency allows for inspection without tape removal
A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.
For more information about Wafer De-Taping Tape 3305, visit the official 3M website.
About JAM Industrial Supply of Ohio
Locally owned and operated in Canton, OH, JAM Industrial Supply, LLC has been a 3M Premier distributor and industrial supplier for over 20 years. With our vast network of vendors, we are able to supply the industry’s best products, information, delivery and prices to our customers.
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Buying in bulk? Apply for special discounts on large quantity orders.
Additional information
| Unit of Measure | |
|---|---|
| Product Id | |
| Part Number | |
| UPC | |
| Per Case | |
| Weight | 17.6 lbs |
| Make to Order | |
| Brand | |
| Length | |
| Width | |
| Adhesive Type | |
| Backing (Carrier) Material | Polyester |
| Elongation at Break | 125% |
| Product Color | Green |
| Dimensions | 10.6 × 10.6 × 11 in |
